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Home/ Products / Edge & Device Products / Embedded Computers / MIC-770V3W-E0A1
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MIC-770V3W-E0A1
Modular IPC for Extreme Environemnts, 12th/13th/14th Gen Intel® Core™ i CPU, Intel® R680E Chipset
  • Intel® 12th/13th/14th Gen Core™ i CPU socket-type (LGA1700) with Intel® R680E/ H610E chipset
  • Wide operating temperature (-20 ~ 60 °C)
  • 2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1); 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)
  • 1 x 2.5" HDD/SSD, 1 x mSATA, and 1 x NVMe M.2; 9 ~ 36 VDC input power range
  • IP40 dust proof for deployment in harsh environment
  • Supports FlexIO and iDoor technology, flexible configure additional DP, DVI, COM port, DIO, Remote switch IO
  • Supports Advantech i-Modules; Supports Advantech SUSIAPI and embedded software APIs
  • Supports Intel® vPro™/AMT and TPM technologies; Supports Advantech iBMC 1.2 remote out-of-band power management solution on WISE-DeviceOn
  • Support Windows 11 IoT Enterprise LTSC
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Datasheet | Technical Documents | 3D Models
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MIC-770V3W-E0A1 Modular IPC for Extreme Environemnts, 12th/13th/14th Gen Intel® Core™ i CPU, Intel® R680E Chipset
Include Assembly Fee

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